生产能力-高德电子-高德电子

The following table lists the our China factory (suzhou, Jiangsu Plant I, Jiangsu Plant II) of process capability

Capability		Current			Future
Capability		Suzhou	Jiangsu Plant I	Jiangsu Plant II	Suzhou	Jiangsu Plant I	Jiangsu Plant II
Plant Capacity (Kilo SF/Month)		800K	850K	1200K	800K	900K	1500K
Layer Count (Layer)		2 ~ 14	2 ~ 26	2 ~ 26	2 ~ 20	30	30
Line Width/Spacing (mm)		0.1/0.1	0.05/0.05	0.05/0.05	0.1/0.1	0.04/0.04	0.04/0.04
Drill Size (mm)
Mechanical size Min (mm)		0.2	0.1	0.1	0.2	0.075	0.075
Laser size (mm)		N/A	0.075	0.075	N/A	0.05	0.05
Electrical Test Pitch (mm)		0.4	0.2	0.2	0.4	0.2	0.2
Board thickness (mm)
Min Thickness	2L	0.5	0.15	0.15	0.5	0.1	0.1
Min Thickness	4L	0.5	0.25	0.25	0.5	0.2	0.2
Board Finishing
OSP		●	●	Produced in Wuxi	●	●	Produced in Wuxi
ENIG		●	●	Produced in Wuxi	●	●	Produced in Wuxi
Selective ENIG		●	●	Produced in Wuxi	●	●	Produced in Wuxi
ENEPIG		Produced in Wuxi	●	Produced in Wuxi	Produced in Wuxi	●	Produced in Wuxi
Hard gold		Produced in Wuxi	●	Produced in Wuxi	Produced in Wuxi	●	Produced in Wuxi
Soft gold		Produced in Wuxi	●	Produced in Wuxi	Produced in Wuxi	●	Produced in Wuxi
Immersion Tin		●	●	Produced in Wuxi	●	●	Produced in Wuxi
Immersion silver		●	●	Produced in Wuxi	●	●	Produced in Wuxi
HASL & Lead free HASL		Sub-contract	Sub-contract	Sub-contract	Sub-contract	Sub-contract	Sub-contract
Material
FR4 (Leed-Free / Halogen-Free / Middle-Tg / High-Tg）		●	●	●	●	●	●
BT		○	●	●	○	●	●
High Speed & High Frequency		○	●	●	○	●	●
High Thermal Conductive / IMS		●	○	○	●	○	○
Polymide		○	●	●	○	●	●
EMI		○	●	●	○	●	●
Special Process/Product
HDI		○	●	●	○	●	●
Rigid-Flex		○	●	●	○	●	●
Semi-Flex		●	○	○	●	○	○
Heavy Copper		○	●	○	○	●	○
Back Drill		○	●	●	○	●	●
High Speed / High Frequency		○	●	●	○	●	●
High Layer Count		○	●	○	○	●	○
LED/ CMOS		○	●	●	○	●	●
High Thermal Conductive		●	●	○	●	●	○
Copper Inlay		○	●	○	○	●	●

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